AYN

Senior Process Integration Engineer

Employer not yet confirmed · Sherman, Texas, United States · hybrid

- Responsibilities

- Drive new product and new process development to ensure timely and successful delivery of qualified products.

- Oversee day-to-day progress of matrix lots to keep development activities on track.

- Manage part numbers and BOM to ensure proper setup for new product introduction.

- Support the NPI team in establishing mask sets, process flows, and workflows for both front-end (wafer fabrication) and back-end (die assembly and characterization) processes.

- Assist in failure analysis by investigating issues found during wafer fabrication and product characterization and take the lead in analyzing root causes.

- Coordinate production ramp-up readiness by working closely with cross-functional teams—including EPI, process, assembly, test, and product engineering—to ensure readiness in areas such as chip design/specs, equipment, process documentation, and data infrastructure.

- Collaborate with the product engineering team to improve yield, especially in addressing characterization issues that span multiple process areas.

- Design and execute experiments related to design, process, and testing to identify and implement corrective actions for failure modes encountered during new product development.

- Experience

- 3 years of experience in III-V semiconductor laser related device design, process

development and characterization is required.

- PhD degree in electrical engineering, material science, physics, or other relevant

major.

- Skills & requirements

- Hands-on experience with design, process and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.

- Strong statistical data analysis skills (JMP or Minitab etc.).

- Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management etc.).

- Experience with optoelectronic device reliability testing and modeling is a plus.

- Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.

- Strong ability to drive actions and solutions through cross-functional teams.

- Collaborate in a professional and respectful manner with coworkers, vendors, contractors, etc.

- Oversee new product and process development, ensuring timely qualification and launch.

- Manage day-to-day progress of development activities, keeping projects on track.

- Support NPI team in establishing mask sets, process flows, and workflows for front-end and back-end processes.

- Lead failure analysis, investigating issues during fabrication and characterization.

- Coordinate production ramp-up with cross-functional teams, ensuring readiness in all areas.

- Collaborate with product engineering to improve yield and address characterization issues.

- Design and execute experiments to identify and correct failure modes.

- Manage part numbers and BOM for new product introductions.

- Ensure proper setup and documentation for smooth transition to manufacturing.

- PhD in Electrical Engineering, Material Science, Physics, or related field.

- 3+ years of experience in III-V semiconductor laser device design, process development, and characterization.

- Hands-on experience with optoelectronic device design, process, and characterization (VCSEL, DFB laser, etc.).

- Strong statistical data analysis skills (JMP, Minitab, etc.).

- Familiarity with semiconductor wafer fab operations and processes.

- Experience with optoelectronic device reliability testing is an asset.

- Excellent communication skills, able to lead meetings and resolve conflicts.

- Proven ability to drive cross-functional teams and actions.

- Professional and respectful collaboration with colleagues and external partners.

- Ability to work in a cleanroom environment and with hazardous materials.

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