Senior Staff, Technical Program Management, Power Package NPI
Renesas Electronics · Plano, Texas, United States · hybrid
Own the execution of Renesas’ strategic AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs, from development and qualification through production ramp, in a fast-paced, high-growth environment. You will collaborate with product Technical Program Managers (TPMs) and personnel embedded at key global OSATs, to deliver committed schedules and quality, reliability, and production-readiness objectives.
You will partner closely with Package Engineering leadership, Power product group teams, and OSAT/CM partners, escalating critical risks early and leading cross-functional technical task forces on issues that threaten quality, reliability, yield, manufacturability, cost, or schedule.
KEY RESPONSIBILITIES
- Lead Technical Program Management execution for strategic AI/Datacenter Infrastructure Power NPI and package engineering programs, directly managing complex programs as needed.
- Partner with Package Engineering Directors and technical leads, providing program-level execution leadership, governance, and accountability while keeping technical ownership clear and unduplicated.
- Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment to achieve committed schedules.
- Establish a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
- Continuously improve standardized processes, templates, metrics, escalation mechanisms, and lessons-learned practices, and drive consistent execution standards across internal teams and strategic OSAT locations.
- Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks and establish mitigation plans.
- Escalate critical issues with clear recommendations and decision points.
- Lead cross-functional technical task forces, collaborating closely with internal teams and external partners (OSAT/CM, customers), on issues that threaten quality, reliability, yield, manufacturability, qualification, schedule, or customer commitments, including process-integration and assembly problems.
- Drive root-cause analysis and data-based decisions, and hold corrective/preventive actions through to closure.
- Coordinate closely with Power product group partners (Design, Application, Marketing), Product Engineering, Reliability, Quality, Operations, and Supply Chain to remove execution barriers and maintain program momentum.
- Establish program dashboards and management systems giving transparent visibility into milestones, critical path, risks, issues, action owners, and recovery plans.
- Collaborate and drive key OSAT/CM partners through program reviews, milestone tracking, issue escalation, and recovery plans.
- Ensure Engineering Build Requests (EBRs) are executed on committed schedule at each OSAT, tracking progress, identifying delays, and driving recovery actions.
- Align OSAT/CM development activities (DOE, process optimization, process-window verification, production controls) and qualification and ramp readiness with overall NPI program objectives..
- Build strong working relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.
- Ensure effective transition from development and qualification into production through readiness reviews, ramp monitoring, and issue management.
- Provide concise, fact-based communication to directors and senior leadership on program health, critical risks, schedule recovery, resource needs, and decisions required.
- Support package technology roadmap execution by translating strategic priorities into executable programs, milestones, resources, and deliverables.
LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES
- Translate organizational priorities into team objectives, staffing recommendations, performance expectations, and development plans.
- Foster a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.
- Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.
- 12+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field, including experience leading complex cross-functional programs.
- Demonstrated experience managing complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
- Strong understanding of semiconductor product development process, package and assembly processes.
- Hands-on experience in Power Management products, particularly with several of these: power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
- Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
- Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
- Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
- Strong program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
- Strong interpersonal, communication, negotiation, and presentation skills, including the ability to communicate effectively with senior leaders.
- Ability to influence technical and business leaders without direct authority and drive accountability across organizational boundaries.
- Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
- Willingness to travel domestically and/or internationally approximately 10–20% of the time, including to OSAT/CM sites.
PREFERRED QUALIFICATIONS
- Experience supporting high-growth, high-visibility customer programs.
- Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip, or advanced interconnect technologies
- Experience with formal technical program management methodologies and portfolio-level governance.
- Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.
SUCCESS MEASURES
- On-time achievement of NPI milestones and customer commitments.
- Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.
- Timely closure of critical cross-functional task-force actions.
- Improved qualification, yield, reliability, and production-readiness performance.
- Effective execution and alignment of strategic OSAT/CM partners.
Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure